Customers: Semiconductor (chip/wafer manufacturers), Film manufacturers, Camera manufacturers Applications: - Semiconductor Vacuum hold down for “chips” for subsequent manufacturing operations Rotary vacuum chucks for the application of photo-sensitive liquid to substrate material for electronic and integrated circuitry components - Film Manufacturing Vacuum transfer platens on an automatic rotary index machine Vacuum hold down for transporting film - Camera Manufacturing Vacuum Platen for an assembly operation
Advantages of Odem Porous vacuum chuck versus standard vacuum chuck: - Conventional vacuum chucks and platens made from a series of interconnected slots with an external o-ring to maintain vacuum over the surface results in stress on the material being held down. - Drilled holes in the vacuum chuck or platen surface produce a pattern on the thin film or other surface sensitive materials and holding power is limited due to the minimum vacuum area of the small holes. Ceramics are susceptible to thermal shock.
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